Key features of the PlasmaPro 800Plus

  • Up to 40 x 2", 19 x 3", 10 x 4", 2 x 6" or one 8"/200 mm or 12"/300 mm wafer(s) can be loaded
  • Substrate temperature control is provided up to 400°C
  • Endpoint detection by laser interferometry and/or optical emission spectroscopy can be fitted to the PlasmaPro 800Plus to enhance etch control
  • Options of a 8- or 12-line gas pod provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool
  • Industry proven for HBLED processes