Titanium Nitride (TiN) Deposition

TiN has may be deposited using Physical Vapour Deposition  (PVD), also known as Sputter Deposition.

 

 

 

Process Specification

  PlasmaPro System400
Deposition rate: > 1.5nm min
Uniformity: ± 5% (200mm Target Size)
Single wafer size: Up to 150mm
Batch size: 4 x 150mm or 8 x 100mm