Our range of plasma processing systems provide a complete solution to Atomic Scale Processing

Unique cluster capability or stand alone systems enabling the manipulation of matter with atomic scale precision

Specialised hardware with the ability to control plasma to deposit, grow and etch exciting new materials that enable the next generation of device technology

Example: FET flow diagram

Sputter/evaporate metal contactAtomic Layer DepositionSputter/evaporate metal contactAtomic Layer EtchCVD or ALD of 2D TMDCs

Atomic scale processing solutions in one system

Sputter/evaporate metal contactAtomic Layer EtchAtomic Layer DepositionCVD or ALD of 2D TMDCs

Related Process Techniques

ICP CVD

ICP CVD

Plasma deposition of high quality dielectric films at low temperature with low damage.

Physical Vapour Deposition (PVD)

Physical Vapour Deposition (PVD)

Magnetron sputtering of high quality metals and alloy films

Nanoscale Growth

Nanoscale Growth

CVD, PECVD and ICP CVD for growth of nanomaterials

 

Related Tools

FlexAL-montage

FlexAL ALD Tool

Remote plasma & thermal ALD in one flexible tool

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 offers advanced plasma etch and deposition solutions on one platform with loadlock or cassette to cassette for RIE, ICP etch, ICP CVD and PECVD, upto 200mm single wafer platforms or multi-wafer batch capability.

Nanofab

Nanofab

Controllable growth of nanotubes and nanowires with flexible temperature up to 1200°C

PlasmaPro 400

PlasmaPro 400

Magnetron sputtering process tool for Physical Vapour Deposition (PVD)